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Bond-1SF

Solvent-Free, Self-Etch, Single-Step Bonding Agent

-Solvent-free: Reduces sensitivity and avoids issues like under- or over-drying
-No air drying required
-One coat
-Self-etch: Eliminates the need for acid etching, protecting against sensitivity
-Versatile: Compatible with light cure and dual cure materials

-Direct composite restorations
-Bonding agent for repairs to composite, ceramic and metal substrates
-Pit and fissure sealant
-Compatible with dual cure materials, only when the initial layer is light initiated

Bond-1 SF Syringe Kit:
-Includes 2 × 1 ml syringes
-Comes with flocked needle tips and instructions
Accessories:
-100 pack of 25-gauge flocked needle tips

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